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eNewsletter
September 2008 |
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Industry News
- Global Market for Printed Electronics Worth $8.8 Billion by 2013
- Merck and Delo Industrial Adhesives Form Partnership, Focus on new materials for OLED Applications
- Optomec and Applied Nanotech Holdings, Inc. Announce Strategic Cooperation to Introduce Optimized Copper Inks for Aerosol Jet Printing for Printable Electronics
- The Newly Named FlexTech Alliance Will Support Displays and Accelerate Advances in the Emergent Flexible Electronics Marketplace
Product News
- Broadband Polarizer Slims to 0.2 mm Thickness
Event Listing
- Thermal Management and Technology Symposium 2008
Sept. 25-26
Austin, Texas
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Thermal Management and Technology Symposium 2008
Sept. 25-26
Hyatt Regency Austin in Austin, Texas
Thermal Management and Technology Symposium 2008 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held September 25-26 in Austin, Texas. |
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| INDUSTRY NEWS |
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Global Market for Printed Electronics Worth $8.8 Billion by 2013
According to a new technical market research report, Printed Electronics: Materials, Applications and Markets, from BCC Research, the global market for printed electronics is expected to be worth $3.1 billion in 2008. This will increase to $8.8 billion by 2013, a compound annual growth rate (CAGR) of 23.2 percent.
The market is broken down by application and includes optoelectronics, radio frequency (RF), energy, sensors and other applications. Optoelectronics applications dominate the market with a share of more than 85 percent in 2007 and 2008, declining to 69 percent in 2013. Optoelectronics generated $2.5 billion in 2007, an estimated $2.7 billion in 2008 and $6.1 billion in 2013, for a CAGR of 18.1 percent.
Sensors were the second largest segment in 2007 with $375 million in revenue and should continue in second place through 2008, generating $423.5 million. Sensors should grow in absolute terms but lose market share over the next five years, declining from 13 percent of the market to 9.5 percent. Expected revenue in 2013 is $842.5 million, for a CAGR of 14.7 percent.
RF applications are expected to grow from $10.0 million in 2007 to $18.4 million in 2008 and $413.0 million in 2013, a CAGR of 86.3 percent. The energy segment is the fastest growing segment and is expected to achieve a market share of 16.2 percent by 2013. Energy applications generated $9 million in 2007 and are expected to reach $18.1 million in 2008. This is expected to increase to $1.4 billion in 2013, for a CAGR of 139.5 percent.
Other applications are expected to grow at a CAGR of 118.7 percent, from an estimated $1.0 million in 2008 to $50.0 million in 2013.
Currently, major end-uses of printed electronics include consumer products, advertising and medicine and health care/life sciences. End-user segments that are expected to gain significant market share over the next five years include building products and transport and logistics.
Merck and Delo Industrial Adhesives Form Partnership, Focus on new materials for OLED Applications
Merck KGaA and Delo Industrial Adhesives have formed a strategic partnership in the field of organic light-emitting diode (OLED) technology. Within the scope of their agreement, the companies plan to develop future system solutions for OLED applications. The companies will join forces to market OLED adhesive products from Delo through Merck’s extensive marketing and sales channels. In addition, Merck and Delo intend to develop innovative materials for improved OLED sealants that will facilitate the entry of OLEDs into large-format display applications.
OLEDs show a high potential as the display technology of tomorrow and already are being used in MP3 players and cell phones. Within the OLED technology, Merck offers light-emitting materials while Delo offers new adhesive systems required to produce OLEDs. Merck’s OLED materials are characterized by high quantum efficiency and longevity and the adhesives developed by Delo reliably seal off the sensitive metal layers from oxygen and moisture. This extends the life of OLEDs.
Optomec and Applied Nanotech Holdings, Inc. Announce Strategic Cooperation to Introduce Optimized Copper Inks for Aerosol Jet Printing for Printable Electronics
Applied Nanotech Holdings, Inc.’s subsidiary, Applied Nanotech, Inc. (“ANI”), established a strategic development program with Optomec, Inc. a company specializing in printed electronics for solar, display, electronic packaging and flexible electronics applications.
As a part of the commitment, ANI will install a dedicated Optomec M3D Aerosol Jet printer at its facilities in order to adapt its revolutionary copper ink to Optomec’s patented ultra high resolution printing technology. By utilizing ANI’s copper ink, the Optomec printer will offer the solar, display, flexible circuit and PCB manufacturers contact-free deposition of high quality, low cost metal lines.
The Optomec printing solution is able to produce much finer lines than is currently possible with traditional screen printing and inkjet printing equipment. The combined ANI/Optomec copper ink printing solution will provide an alternative to silver inks facilitating lower cost, coupled with the promise of higher reliability. Furthermore, ANI’s copper inks do not require expensive vacuum installation or inert gas environment lowering the cost of the capital for manufacturing equipment.
The Newly Named FlexTech Alliance Will Support Displays and Accelerate Advances in the Emergent Flexible Electronics Marketplace
The US Display Consortium (USDC) has formally expanded its mission to support the emerging flexible, printed electronics market, subsequently changing the organization’s official name to the FlexTech Alliance to reflect this new activity and opportunity. The USDC board took this action to signal its intent to commit resources to the increasingly synergistic technologies driving advances in the flexible and printed electronics sector. At the same time, the board recommitted its support for supply chain development for next-generation displays, such as OLEDs, flexible displays, MEMs-based and 3D displays.
USDC officials state that the move is a natural progression for the organization based on the success of the Flexible, Printed and Organic (FPO) Electronics Initiative that it launched in December 2006, which was designed to gauge potential development and growth of this new market. Since the launch of that initiative, industry interest has grown steadily with a definite need for programs dedicated to the sector. Based on substantial industry and academic support, as well as the growing synergies between all of its served markets, the USDC board has now officially broadened the consortium’s mission to serve the common interests of the display industry and the flexible, printed electronics industry.
As part of this effort, the USDC and all of its programs will be absorbed under the broader FlexTech Alliance umbrella. In addition to continued strong emphasis on electronic display supply chain R&D, the FlexTech Alliance will focus on creating a flexible, printed electronics infrastructure within North America that will ultimately enable the production of active, ubiquitous devices. These devices will be manufactured using new, flexible form factors that deliver high functionality at low cost. Near-term applications for this market include RFID tags, sensors (chemical/biological), energy (e.g., solar cell panels and flexible batteries), solid-state lighting, medical/healthcare, disposable electronics and displays. Given their myriad applications, FPO electronics hold tremendous potential, with experts predicting that the market for some applications could exceed $50 billion by 2017.
The FlexTech Alliance will be overseen by a world-class Governing Board, along with a seasoned management team that includes Dr. Mark Hartney as CTO; Kay Mascoli as director of development and planning; Dr. Kevin Cammack as director of technical marketing and development; and Heidi Hoffman, director of events and marketing communications. The organization will deliver its services in national settings, via an expansive industry web portal, and through regional chapters. To this end, the FlexTech Alliance will help the North American industry meet the challenges facing it by facilitating partnerships, ensuring R&D support, developing product demonstrators, identifying and addressing manufacturing issues, along with broadening funding opportunities. |
| PRODUCT NEWS |
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Broadband Polarizer Slims to 0.2 mm Thickness
Elliot Scientific has added the latest CODIXX colorPol IR 1550 telecoms’ polarizer to its current range. With a super-slim thickness of 0.2 mm and excellent performance, the IR 1550 BC4 T2 HT model is the result of a continuous development programm between end-users and manufacturer.
Designed with an insertion loss of less than 0.1 dB especially for broadband telecom applications, the filter offers unique transmittance properties of > 98 percent, with AR coating, and a maximum contrast of greater than 10,000:1 in the spectral ranges 1280~1450 nm and 1480~1650 nm - an extinction ratio that exceeds 40 dB.
The exclusive halide-free technology developed by CODIXX uses embedded prolate silver nano-particles in soda-lime glass to make colorPol polarizers resistant to most chemicals, UV radiation and harsh environmental conditions – they can withstand temperatures of up to 400°C.
CODIXX colorPol polarizers are available in various shapes and sizes, such as standard mounts with diameters of 12.5, 12.7 (1/2 inch), 25.0 and 25.4 mm (1 inch) and rectangles with dimensions from 1 mm². |
| EVENT LISTINGS |
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Thermal Management and Technology Symposium 2008
Sept. 25-26
Hyatt Regency Austin in Austin, Texas
Thermal Management and Technology Symposium 2008 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held September 25-26 in Austin, Texas.
This event will feature presentations on thermal manufacturing technology, materials and R&D. Topics will include new thermal technology as well as the latest market trends affecting the industry. The conference is designed for design engineers, system engineers, process engineers, material scientists and R&D managers with organizations in a variety of industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
If you are involved in electronics, semiconductor, manufacturing, process industries, food, healthcare, R&D or temperature control industries, this is a must attend event.
Contact Jeremy Fleming about sponsorship/exhibitor information. |
| JOB LISTINGS |
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| Upcoming Industry Events - Click here to view full Calendar |
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September
6-11 Digital Fabrication 2008 and NIP24, Pittsburgh, Pa.
8-10 RFID World, Las Vegas, Nev.
9 3rd Annual Displaybank San Jose Conference, Santa Clara, Calif.
October
7-9 Printed Electronics Asia, Tokyo, Japan
27-29 4th Global Plastic Electronics Conference & Showcase,
Berlin, Germany
Organic Eelctronics Week
Nov. 10-14, 2008
La Jolla, Calif.
IntertechPira is pleased to announce a full week of organic and flexible displays and electronics conferences: 10th annual OLEDs World Summit, Thin-Film Transistors and 6th annual Flexible Displays and Electronics. This series of events will be held November 10 – 14, 2008 at the Hilton Torrey Pines in La Jolla, California.
OLEDs World Summit will open the week on November 10 – 12, Thin-Film Transistors will be a half-day conference on the morning of November 13, and Flexible Displays and Electronics will close out the week on November 13 – 14. Visit www.organicelectronicsweek.com for complete details.
Discounted registration packages are available for attending any two or all three conferences. Please contact Mike Robert at mrobert@intertechusa.com or +1 207 781 9631 for complete pricing options.
www.organicelectronicsweek.com
10th Annual OLEDs World Summit
November 10 – 11
Hilton Torrey Pines, La Jolla, CA, US
Co-chaired by:Dr. David Fyfe, CEOCambridge Display Technology, and Mr. Chang Hoon Lee, Senior Manager AMOLED Technical MarketingSamsung SDI
Now in it’s 10th year, OLEDS World Summit will serve as a leading forum for attendees to receive the most current information in this ever-changing competitive industry. With over 150 leading industry executives expected to attend, this year’s program is set to include an exhibit area featuring the latest technology, 20 speaker presentations, various question and answer sessions, panel discussions, networking functions and more! Confirmed speakers include: Cambridge Display Technology, Samsung SDI, Nokia, Universal Display Corp, Display Search, OLED-T, OLED Association, OLLA Project, Vitex Systems, IGNIS Innovation, Aixtrox and FUJIFILM Dimatix. For the latest program updates and to register go to: www.organicelectronicsweek.com
Flexible Displays and Electronics
Nov. 13-14
LA Jolla, Calif.
As the flexible displays and electronics market continues to experience explosive economic and technological growth, IntertechPira’s 6th annual Flexible Displays and Electronics conference is both timely and practical, providing a unique opportunity to gain the necessary knowledge and network with industry leaders from around the world on this dynamic and growing industry.
To view the final program details, including company presentations and early bird registering options visit: www.organicelectronicsweek.com.
Printed Electronics 2008
Dec. 2-5
San Jose, Calif.
The Printed Electronics 2008 conference and exhibition hosted by IDTechEx will be held on December 2-5, 2008 in San Jose, CA.
This fifth annual conference and exhibition covers all the applications, technologies and opportunities surrounding printed electronics. Anticipating over 800 delegates and 100 exhibitors, this is the world's largest event on the topic. A full range of samples and demonstrations will be available and many subjects will be aired for the first time, making this conference unmissable.
Potentially printed electronics is covered as well as printed electronics and market figures will be presented for the full $300 billion opportunity opening up, as well as the needs of potential users.
In addition to the speakers and exhibitors, experts in interactive consultancy-style sessions will bring you up to date with varying topics through our Masterclasses. Masterclass delegates will also attend exclusive company visits.
There will also be an Investment Forum at the Printed Electronics 2008 conference; this forum will bring together leading pure-play printed electronics companies with the investor community. Fifteen company CEOs will pitch to an audience of potential investors.
To be part of this truly unique conference, register now, information can be found at www.IDTechEx.com/peUSA.
3rd Annual Plastic and Thin Film Photovoltaics
Dec. 8-10
Barcelona, Spain
IntertechPira expert one and a half day conference and half day pre-conference workshop
December 8-10, 2008, Hotel Barcelo Sants, Barcelona, Spain.
Catch up on the latest developments in technology and commercialization for organic PVs at this insightful conference!
www.plasticandthinfilmpv.com
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