DuPont Teijin Films and Thin Film Electronics Sign Memo of Understanding for Production of Printed Memories
Thin Film Electronics ASA (Thinfilm) of Norway, has entered into a memorandum of understanding with DuPont Teijin Films UK Ltd to enable volume production of printed memory devices.

The objective of the collaboration is to enable low-cost production of printed memories where DuPont Teijin Films will supply existing, commercially available substrates or specifically developed substrates to Thinfilm’s production partners and customers.

“Thinfilm has found that substrates from DuPont Teijin Films have excellent performance as substrates for printed memory, making them highly suitable for the implementation of our polymer memory technology in a wide range of applications and products such as smart labels, smart packaging, game cards, smart cards, toys and RFID tags,” said Johan Carlsson, CEO of Thin Film Electronics. “DuPont Teijin Films has already a broad range of high performance substrates in the market and is with its worldwide presence an ideal partner for Thinfilm, enabling us to speed up the commercialization of our technology and for our customers to secure a reliable supply of substrates. Following the joint development agreements with print equipment, ink suppliers, manufacturers and application developers announced in 2007, we have with this collaboration and MOU completed the full value chain and secured technology partners in all areas enabling our manufacturing partners to produce Thinfilm printed memories in high volumes.”

Endicott Interconnect Technologies and Unimicron Technology Corp. Create Sales and Manufacturing Agreement for Volume Production of CoreEZ Organic Substrates
Endicott Interconnect Technologies, Inc. (EI) has entered into a sales and manufacturing agreement with Unimicron Technology Corp., Taiwan, to produce CoreEZ organic substrates at one of its facilities. Under terms of the agreement, EI, as the original design manufacturer, maintains control of the design and technical support worldwide for the CoreEZ product line. Unimicron will be the high volume manufacturer of CoreEZ products per EI’s specifications and requirements. Sales of CoreEZ products will be jointly handled by the two companies.

CoreEZ organic substrates offer a very dense, thin core, build-up flip chip technology that combines good electrical, reliability and wireability performance with a very cost effective material set. It is ideally suited to high speed graphics and microprocessor applications.

USDC Awards Optomec Contract to Develop New Printing Technology
The US Display Consortium (USDC), a public/private partnership chartered with developing the flexible electronics and displays industry supply chain, has entered a one-year development contract with Optomec to further develop its M3D Aerosol Jet System, enabling finer resolution line widths and faster, more efficient production capabilities for printed electronics. The $750,000 cost-shared award will provide Optomec the opportunity to extend its proprietary additive manufacturing technology to a level that has not been possible before through more traditional printing techniques.

Under the USDC agreement, Optomec will focus on developing a printing platform for next-generation devices, such as high-density circuitry for printable electronics, displays and photovoltaic cells. The new printing system will use a multi-nozzle aerosol jet deposition that eliminates the need for screens or stencils required by traditional contact deposition processes, while enabling much finer resolution, down to 4µm fine line-widths. The new Optomec system will have many advantages over ink jet printing, which is currently the preferred process for printed electronics. In addition, the additive process employed by the M3D reduces environmental impact by minimizing the waste and chemicals that are part of more traditional manufacturing processes.

Kodak Active Matrix OLED Technology to be Incorporated Into a Variety of Next-Generation Portable Media Devices
Eastman Kodak Company, a company focused on organic light emitting diode technology (OLED), has entered an intellectual property cross-licensing agreement with LG Display Co., Ltd., of Korea, a flat- panel display company.
 
The license, which is royalty bearing to Kodak, enables LG Display to use Kodak technology, including yield-improving capabilities for Active Matrix OLED (AMOLED) modules, in a variety of small- to medium-sized display applications such as mobile phones, portable media players, picture frames and small TVs. The agreement also enables LG Display to purchase Kodak's patented OLED materials for use in manufacturing displays. Financial terms of the agreement were not disclosed.

“AMOLED is the newest generation of display technology and will compete in the full spectrum of size ranges,” said Andrew Sculley, heneral manager and vice president, Kodak’s Display Business. “AMOLED technology offers superior product performance, and ultimately low-cost manufacturing advantages. We’re proud and pleased that LG Display has chosen to incorporate our OLED technology to power a variety of innovative new consumer display products.”

The agreement with LG Display is the latest in a series of moves that Kodak has made as the company commercializes its innovative OLED technology. Recently, KAGA Electronics of Japan announced plans to introduce the world’s thinnest, lightest portable 1-Seg television featuring a full-color, 3.0-inch OLED display utilizing Kodak’s AMOLED technology, which includes Kodak’s patented Global Mura Compensation that provides overall yield improvement. The Kodak Elite Vision AMOLED 1-Seg TV was co-developed by Kodak, LG Display, KAGA Electronics and Andes Electronics and was available in Japan in March.

Agilent Technologies’ New Cover-Extend Technology Eliminates Need for Physical Test Points for In-Circuit Test
Agilent Technologies Inc. has released a limited-access solution for In-Circuit Test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide. Part of Agilent’s VTEP v2.0 Powered test suite, the Agilent Cover-Extend Technology is a hybrid between two established test methodologies in the electronic manufacturing industry: Boundary Scan and VTEP Vectorless Test.

Unlike traditional VTEP test, which requires physical test points on the printed circuit board assembly (PCBA) for the injection of test stimulus signals, Agilent’s Cover-Extend relies on stimulus provided by Boundary Scan cells, which do not require physical test points. The benefits of this technology include:

• Improved test coverage, which preserves users’ investment in in-circuit testers. Cover-Extend can recover up to 50-percent node access.
• Significant savings on fixturing, a continuous operating cost that can easily exceed the price of the ICT system itself over time. A typical factory using Cover-Extend on 30 lines can potentially save up to $500,000 per year.
• Strain relief on solder joints, resulting from fewer test probes needed underneath high-density ICs (e.g., BGAs), greatly reduce potential solder-joint damage due to excessive strain.

“Cover-Extend addresses key concerns in today’s manufacturing environment – cost, coverage, quality and speed,” said Daniel Mak, vice president and general manager of Agilent’s Measurement Systems Division. “The results we are getting from our customers’ lines are very positive, and we will implement Cover-Extend in full-scale production environments with some of our key customers in April.”

Agilent customers with valid software-upgrade contracts for the i3070 and VTEP-equipped fixtures can receive this new technology by purchasing an additional software license and a fully VTEP-compatible fixture hardware upgrade. Pricing for the license will include attractive bundles for new and current Agilent boundary-scan customers. Pricing for the VTEP fixture hardware upgrade will be similar to existing Agilent VTEP fixture hardware products.

Limited shipments of the product have begun. Full availability will be in the second half of 2008.

Digital View Introduces ActivPrint for Digital Signage
Digital View, supplier of display electronics products for video promotion and digital signage solutions, has introduced ActivPrint, a new technology that turns static advertising into animated displays.

ActivPrint uses programmable e-paper technology and animation combined with the latest design techniques to bring advertising materials to life – in any shape, and with up to 10 animation steps – creating a high-resolution, flexible and cost-effective advertising display. It can be used on shelves or integrated into any type of advertising solution. ActivPrint animations are simple, eye-catching and effective. These displays can be positioned anywhere around an environment to truly captivate an audience, build brand awareness and raise sales.

“If a client is not quite ready for video, and print just isn’t good enough, now there’s ActivPrint,” said Dusty Perryman, director of sales, Media Products. “It can handle standard or custom shapes, operates up to a year on two AA batteries, consumes hardly any power, and turns static advertising into a high-resolution animated display that really enhances your message.”

ActivPrint uses black (negatively charged) and white (positively charged) pigment microcapsules. When an electric current runs through it, positive or negative current can be used to control which different color microcapsules are brought to the surface. This has the effect of “turning on” positively charged white microcapsules and making the image visible or, by turning on the black, negatively charged microcapsules, making the image invisible (in effect, “hiding” it).

Digital View’s design team can create customer designs from scratch and, after initial consultation, produce eye-catching solutions that use the technology to its best effect. Where existing design concepts are to be used, the Digital View team will verify the design and, if necessary, suggest any alterations for submission that are necessary to make it compatible with ActivPrint technology.

Osram and Lighting Designer Ingo Maurer Introduce OLED Table Lamp
Ingo Maurer, lighting designer, is the first to use OLEDs from Osram in a functioning table light. The limited-edition light, known as Early Future, shines with tiles directly from the Osram laboratory and demonstrates the potentials of using OLEDs to create future applications with eye-catching illumination and design elements.

Osram Opto Semiconductors made prototypes of organic light emitting diodes available to the designer for his exclusive creation. “We are proud that our OLEDs have inspired such a renowned artist as Ingo Maurer to create such an exciting work of art. Early Future is a vision that has become reality. It gives us a glimpse of just how versatile organic OLEDs can be in terms of their design options and applications,” said Martin Goetzeler, CEO of Osram.

Ingo Maurer used OLED tiles with an area of 132 mm by 33 mm for his creation. For Maurer, unusual design is not an end in itself. Maurer has been shaping developments in light-as-art and lighting design for many years. In 1966 he exhibited the designer luminaire Bulb which has been on exhibit in the New York Museum of Modern Art since 1969 along with other works of his. Through the years, Ingo Maurer has received numerous awards for his avant-garde work with light.

There are possible applications for these new light sources in the automotive industry as well. Rear lighting elements could someday be integrated entirely within the rear windshield.

Novagard Solutions Announces RTV 800 Series UV/Dual Cure and RTV 800 Series UV Gels for Potting, Encapsulating and Conformal Coating Applications
Novagard Solutions, a manufacturer of advanced silicone-based adhesives, sealants and lubricants has announced additions to its RTV 800 Series UV/Dual cure and RTV 800 Series UV Gels for use in potting, encapsulating, and conformal coatings applications including delicate electronic components, printed circuit boards, lighting designs and various wiring/current carrying electrical devices.

The RTV 800 Series UV/Dual (UV/Moisture) cure materials can lead to improved profits based on higher productivity and throughput. Novagard Solutions has developed these products with cure speeds of less than three seconds. The fast cure allows the end user more production floor space and flexibility because of a reduced racking requirement.

The unique chemistry allows paste-like products to cure up to a 5/8-inch thick with minimal energy requirements. While this is dramatic in the lab, the onsite results with our customer evaluations have indicated significant time savings during actual production testing.

The physical properties can be varied including the viscosity of encapsulant types from a few hundred centipoises for spraying and dip coating to several thousand for thick coating and deeper potting applications up to 3/8-inch thick.  The self-leveling characteristic of these flowable materials and the moisture cure feature allow for shadow curing at room temperature.

The RTV 800 Series UV Gels offer two different products of varying hardness with well suited electrical properties. With cure speeds of less than three seconds and potting opportunities up to ¼-inch in thickness, these gel materials are ideal for encapsulating and staking sensitive electronic components for fast and simple production processes.

The Novagard Solutions RTV 800 Series UV/Dual cure patented technology is based on silicone chemistry, and thus exhibits the well suited physical properties found in silicones such as thermal stability, moisture and weather resistance and resistance to color change. These translucent materials will not degrade or yellow on long-term exposure to light.  The RTV 800 Series UV/Dual cure products are a 100 percent silicone reactive system.

Whether users select a self-leveling flowable material, paste, or a gel, they can be stored at ambient temperature without refrigeration. Since they are 100 percent silicone solids, there are no solvents to handle or report based on local restrictions.

The RTV 800 Series UV/Dual cure products continue to build strength after the initial UV cure cycle. The early set from UV exposure eliminates the need to rack parts or develop a time dependant rotation for complex continuous manufacturing campaigns.

One Month Until the 2008 Magnetics Conference
This two-day conference is a leading global event within the magnetics market, bringing together worldwide magnetics experts. This is a once-a-year opportunity for professionals in the magnetics market to assemble and discuss the latest magnetics developments.

The 2008 Magnetics Conference will focus on the latest advancements in magnetic applications, technology and materials. Serving OEM developers of products that utilize magnets and magnet systems, design engineers, OEM developers involved in EMC technology and magnetic effects, magnetics manufacturers and integrators, and material suppliers in the magnetics industry. Registration is $995.

Attend the 2008 Magnetics Conference to see industry-leading companies such as:
Advanced Magnet Lab, Alliance LLC, AR, Big Horn Valve, Inc., CMS Magnetics, Crane Aerospace & Electronics, Daido Electronics Co., Ltd., Dexter Magnetic Technologies, Electron Energy Corp., GMW Associates, Hitachi Metals, Ltd., Infolytica Corp., Magnequench International, Inc., Magnetic Power, Inc., MAGSYS magnet systems, Metrolab Technology, National Institute of Standards and Technology, Ozenbaugh Engineering, PolarisREM, LLC, Quadrant Technology, Rensselaer Polytechnic Institute, SuperPower, Inc., TarnoTek, Vector Fields Ltd., Walter T. Benecki LLC, WebMagnetics, Inc., West Coast Magnetics
Register Now!

April 2008

1-3 IPC Printed Circuits Expo, APEX and the Designers Summit, Las Vegas, Nev.

8-9 Printed Electronics Europe 2008, Dresden, Germany

14-15 Ink Jet Academy: Theory of Ink Jet Technology, Denver, Colo.

14-15 Ink Jet As A Manufacturing Process Symposium, Denver, Colo.

14-15 Conference on Compound Semiconductor Manufacturing , Chicago, Ill.

16-18 Ink Jet Technology Suppliers' Showcase 2008, Denver, Colo.

19-24 2008 51st SVC Annual Technical Conference, Chicago, Ill.

21-23 Organic Photovoltaics 2008, Philadelphia, Pa.

Meeting of The Electrochemical Society (ECS)
May 18-23
Phoenix, Ariz.

Register now for the 213th Meeting of The Electrochemical Society (ECS) to take place at the Phoenix Convention Center May 18th- 23rd. The program for the Phoenix meeting contains a full range of technical symposia, and is expected to attract over 1,500 scientists and engineers, from a broad range of private and public sector institutions. Technical symposia will include electrochemical and solid-state research ranging from batteries and fuel cells to semiconductors and everything in between. The advanced registration deadline is April 18, so don't delay.

http://www.electrochem.org/sponsorship/exhibits/213/exhibit_213.htm

SEMICON West 2008
July 15-17
San Francisco, Calif.

SEMICON West 2008–Infinite Innovations, Infinite Ideas SEMICON West is the place to see the companies, technologies, and people driving the future of micro design and manufacturing. No other event this year has more new products, more new technologies, and more solutions than SEMICON West.
From the latest developments in cutting-edge materials, to the systems and technologies driving semiconductor designs to the limits of Moore's Law, you'll find everything and everyone in the industry at SEMICON West.

Registration is now open! Plan now to participate and get ready to discover the infinite opportunities shaping the design and manufacture of semiconductors, MEMS, photovoltaics, flexible electronics, and more!

For more information, visit www.semiconwest.org.

Webcom Communications s 7355 E. Orchard Road, Suite 100; Greenwood Village, CO 80111 s
Phone 800-803-9488 s Fax 720-528-3771s www.infowebcom.com